Materials for printed wiring boards using epoxy resin

High Tg/low thermal expansion coefficient epoxy resin materials for high multilayer board materials used in various motherboards for supercomputers, large-capacity servers, and routers

High Performance FR-4 for epoxy resin PWBs has high heat resistance and high frequency characteristics, and has achieved high reliability being adopted as various motherboards for supercomputers, large servers, and routers. It is used as an epoxy resin material for high multilayer board materials with high Tg/low thermal expansion coefficient in lead-free applications, and as a low permittivity/high heat resistance epoxy resin material with superior through hole reliability in high multilayer boards.Furthermore, we have a lineup of epoxy resin materials for high multilayer boards and low permittivity/high heat resistance epoxy resin materials.