Products

Products

Etchants of Copper for PWB

Soft etching agent applied to circuit forming of PWB Clean Etch CPE series

This is a soft etching agent with H2O2/H2SO4 as the main ingredients, and is optimum pretreatment for dry film laminate and solder resist and solder flux etc.

  • It is designed to improve adhesion with various resists through chemically-clean surface treatment.
  • The concentration of the main ingredients H2O2/H2SO4 enables automatic analysis with liquid management device in addition to manual analysis, and is effective in saving energy.

CPE-700 series

CPE-700
  • It forms mild surfaces with less directionality than with conventional buff polishing.
  • It removes oxide layers generated by processes.

CPE-900 series

CPE-900
  • It obtains a roughened copper surface, improving resist adhesion.
  • The COD:BOD value in the chemical is relatively low.

Main Applications

  • Dry film laminate pretreatment
  • Solder resist pretreatment
  • Solder flux pretreatment
  • Blacking process pretreatment