Nikalet（Mold cleaning material/mold release and recovery material for semiconductors）

Mold cleaning material/mold release and recovery material for semiconductors

Nikalet（Mold cleaning material/mold release and recovery material for semiconductors） is a cleaning material and release/recovery material for molds using epoxy resin forming materials.With two types, with respective main ingredients of melamine resin and synthetic rubber, it enables treatment with the same processes as product forming, without the pulling off of molds, bringing about increased productivity.

• Nikalet（Mold cleaning material/mold release and recovery material for semiconductors） ECR-T/Transfer type cleaning material (Main ingredient: melamine resin)
  The variety of types makes it possible to select the optimum cleaning material matched to the various encapsulants and mold shapes, yielding a high degree of cleanability for the resin flow parts.

• Nikalet（Mold cleaning material/mold release and recovery material for semiconductors） RCC/Compression type cleaning material, mold release/recovery material (Main ingredient: synthetic rubber)
• Nikalet（Mold cleaning material/mold release and recovery material for semiconductors） ECR-C/Compression type cleaning material, mold release/recovery material (Main ingredient:melamine resin)
  Generates an effect on the entire mold surface, not just the resin flow parts.In addition, it leads to reduced costs because lead frames are not used, not like the transfer types.