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Flash etching agent for M-SAP・SAP
Flash etching agent for M-SAP・SAP
This is optimum for the removal (flash etching) of seed layers in a modified semi-additive process (M-SAP).It can greatly inhibit the occurrence of side etching (undercutting) compared to chemicals of normal H2O2/H2SO4 compositions.
- It can inhibit undercutting.
- It can inhibit variation of in-plane etching thickness.
- The concentration of the main ingredients H2O2/H2SO4 enables automatic analysis with liquid management device in addition to manual analysis, and is effective in saving energy.